Sanand (Gujarat) March 31: Ashwini Vaishnaw said India is on track to operationalise four semiconductor plants by 2026, as the government accelerates efforts to build a robust domestic chip ecosystem.
The announcement followed the inauguration of Kaynes Technology’s OSAT (Outsourced Semiconductor Assembly and Test) facility in Sanand by Narendra Modi, marking the second semiconductor unit launched in quick succession after Micron Technology’s facility earlier this year.
The minister said two additional plants are expected by 2027, while India’s first semiconductor fabrication unit is targeted for completion in Dholera by 2028. The rapid execution pace was highlighted by the Sanand facility achieving commercial readiness within 14 months.
India’s semiconductor strategy is being supported by the development of a broader ecosystem, including equipment, chemicals, gases, and testing infrastructure, aimed at reducing import dependence and strengthening supply chains.
Vaishnaw noted that nearly 60,000 engineers from over 300 universities have been trained in advanced chip design tools such as Synopsys and Cadence Design Systems, contributing to domestic design capabilities.
Global technology leaders including Nvidia, AMD, and Intel are also expanding advanced chip design operations in India, with work underway on cutting-edge 2-nanometre technologies.
Under the proposed “Semicon 2.0” framework, the government aims to localise the entire semiconductor value chain, from design to manufacturing inputs. India is targeting a position among the top six global semiconductor nations by 2032 and the top three by 2047.
Bhupendra Patel said Gujarat is emerging as a key hub, with Sanand and Dholera expected to develop into a semiconductor cluster supported by policy initiatives, infrastructure upgrades, and talent development programs.
