New Delhi, May 29:The Odisha government has signed a memorandum of understanding (MoU) with Intel and 3D Glass Solutions (3DGS) to introduce substrate manufacturing technology in India, marking a significant step in strengthening the country’s semiconductor ecosystem.
Union Minister for Electronics and Information Technology Ashwini Vaishnaw welcomed the agreement, stating that the partnership would help advance India’s semiconductor manufacturing capabilities.
In a post on X, the minister congratulated the Odisha government, Intel and 3DGS for signing the pact aimed at bringing substrate manufacturing technology to the country.
The agreement builds on Odisha’s growing semiconductor ambitions, which gained momentum earlier this year with the launch of major chip infrastructure projects.
In April, the foundation stone was laid for India’s first advanced 3D chip packaging facility at Info Valley, Bhubaneswar, under the Heterogeneous Integration Packaging Solutions project promoted by 3DGS.
The project involves an investment of nearly Rs 2,000 crore and is expected to manufacture around 70,000 glass panels annually, alongside 50 million assembled units and nearly 13,000 advanced 3D heterogeneous integration (3DHI) modules.
At the time, Vaishnaw said that India’s semiconductor sector is witnessing rapid expansion under the Semicon India Programme, with Odisha emerging as an important hub in the country’s electronics manufacturing roadmap.
Chief Minister Mohan Charan Majhi had earlier stated that Odisha is becoming the only state hosting both India’s first compound semiconductor fabrication facility and first 3D glass substrate packaging unit.
The latest development comes amid the Centre’s continued push to build a domestic semiconductor ecosystem through policy support and investment incentives.
According to the government, 12 semiconductor fabrication or packaging projects and 24 chip design projects have already received approval under the Semicon India Programme.
In addition, the government recently launched an online Investor Support portal aimed at improving investor confidence and addressing industry concerns, further supporting India’s semiconductor manufacturing ambitions.
